摘要
控制电解沉积过程在纯铜的表面制得宏观上致密、光滑的铜镀层,以此镀层来消除叠轧金属层间的复合界面;对此镀层消除叠轧金属层间复合界面的机理进行初步的分析;并应用有限元软件对轧制过程进行计算机模拟分析,验证提出的机理;得出镀层材料塑性变形程度大,有利于消除金属层间复合界面;镀层不引起界面处塑性变形热效应的明显变化。
Electrodeposited coating is compact and smooth in general that is maken by controlling the processor of electrolysis on surface of pure copper.The Electrodeposited coating can eliminate the compounded interface of accttmuhtive roll-bondlng; the paper gives a elementary analysis of the theory about the compounded processor.The result given by finite element analysis prove that the theory analysis is true.The conclusion includes tow items： The first ,Distortion of Electrodeposited coating metal is bigger than work hardening metal; The second , Electrodeposited coating metal does not make the thermo-effect of plastic deformation to change remarkably on the interface.
出处
《机电产品开发与创新》
2007年第1期30-32,共3页
Development & Innovation of Machinery & Electrical Products
关键词
电解沉积
复合界面
叠轧
有限元法
electrodeposited coating： compounded interface
accumulative roll-bonding
finite element analysis
