摘要
通过扫描电镜观察,研究不同处理工艺中电子元件引线框架表面Sn-Cu电镀层上锡须的形成与长大,结果显示,高温高湿处理易于促使锡须的形成与长大,经过一定的时间后,锡须生长速度减缓;循环热处理或室温处理对锡须的形成影响较小;当施加恒定外应力后进行室温处理,锡须的形成完全受到抑制。锡须的形成与长大是由于电镀层中存在压应力,压应力促使镀层中锡发生再结晶并长大成锡须。
By using scanning electron microscopy. （ SEM ）, the effect of treatment condition on the formation and growth of tin whisker from lead - free eutectic Sn - Cu electroplated coating in the surface of pin frame of electronic component was investigated. It is shown that unbiased temperature ＆ humidity accelerated the formation and growth of tin whisker. However, thermal shock or ambient temperature storage did not obviously promote the formation and growth of tin whisker. When adding stress with ambient temperature storage, the formation of tin whisker was completely inhibited. The compressive stress is nec- essary condition for tin whisker growth.
出处
《电子工艺技术》
2007年第1期6-9,共4页
Electronics Process Technology
基金
国家重点基础研究资助(项目编号:G2005CB623704)
关键词
无铅电镀
锡须
热处理
压应力
Lead - free electroplated coating
Tin whisker
Heat treatment
Compressive stress
