摘要
随着计算机技术的发展，采用CALPHAD的方法对钎料合金系统进行最佳合金成分预测成为可能，通过对SnAgCu三元合金系建立亚规则溶体热力学模型，利用Thermo—CaLc计算软件数据库，根据“吉布斯自由能最小值的方法”和“平衡相各组元化学势相等”的原则，确定了最优合金成分相的范围w（Sn）（3～4）％，w（Ag）（0．5～0．9）％，其余为Cu，共晶温度为217℃。用DSC测热的结果与热力学计算的熔化温度值相比较，二者结论基本一致。
As the development of the computer, we are able to speculate optimum composition for solder alloy system by the CALPHAD calculation technology. Sub - regular thermodynamics model was set up for SnAgCu ternary alloy. The Thermo - Calc software was used for Sn - Ag - Cu alloy design basing on the principle of the minimum Gibbs energy in the system and the same chemical potential of the composition when phases reach their stable status. The solder eutectic temperature was calculated for 217 ℃ and the Sn（ 3 - 4）% Ag（0.5 - 0.9 ）% Cu was concluded as the optimization for eutectic composition. And they are almost consistent by comparing results of DSC measurements with molten temperature of thermodynamic calculation.
出处
《电子工艺技术》
2007年第1期10-13,共4页
Electronics Process Technology
基金
吉林省科技发展计划项目（项目编号：20000518）.
