摘要
随着高密度电子组装的发展,BGA的面积越来越大,引脚数不断增加,广泛地应用到PCB的组装中,从而对电子组装工艺提出了更高的要求,特别是对于无铅BGA的返修。因为BGA返修台是一个相对开放的系统,而且无铅焊接需更高的温度,因此需要更高的工艺要求才能保证BGA的返修质量。从无铅焊接工艺和BGA返修台结构的角度,介绍了一种适用于BGA返修的方法。
During high -density electronic assembly development, BGA is used in PCB widely which area is more and more large and solder balls are increased continuously. Electronic assembly assembly process is more strictly than ever to assure the BGA soldering quality, especially lead free BGA rework process. Because BGA rework is a relative open system and lead free soldering need higher temperature Introduce an adapt way of lead free BGA rework by lead free soldering process and BGA rework instrument structure.
出处
《电子工艺技术》
2007年第1期14-16,19,共4页
Electronics Process Technology
关键词
BGA
无铅焊接
返修
热电偶
BGA
Lead free soldering
Rework
Thermocouple
