摘要
Lap joints with a 1 mm^2 cross-sectional area were fabricated using Cu particle enhancemem 63Sn37Pb based composite solder and 63Sn37Pb eutectic solder to examine the influence of stress on the creep behavior of the solder joints. The results indicate that the creep resistance of the composite solder joints is generally superior to that of the conventional 63Sn37Pb solder joints. At the same time, the creep rupture life of the composite solder joints is declined with increasing stress and drops faster than that of the 63Sn37Pb eutectic solder joints.
Lap joints with a 1 mm^2 cross-sectional area were fabricated using Cu particle enhancemem 63Sn37Pb based composite solder and 63Sn37Pb eutectic solder to examine the influence of stress on the creep behavior of the solder joints. The results indicate that the creep resistance of the composite solder joints is generally superior to that of the conventional 63Sn37Pb solder joints. At the same time, the creep rupture life of the composite solder joints is declined with increasing stress and drops faster than that of the 63Sn37Pb eutectic solder joints.
基金
This study is financially supported by the Foundation of Henan University of Science & Technology(No.13420060)
Luoyang Advanced Hydraulic Pressure Technology Ltd. ( 6142004).
