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粉体特性对铜基金属粉末选区激光烧结的影响 被引量:4

Effects of Powder Characteristics on Selective Laser Sintering of Copper-based Metal Powder
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摘要 设计制备了多组分铜基金属粉末(组分包括Cu,Cu-10Sn,Cu-8.4P),并基于液相烧结机制实现了粉体激光烧结成形。研究了粉体特性(粉末粒度、颗粒形貌、化学成分、组分比例及混粉均匀性)对烧结致密度及显微组织的影响。结果表明:粗细粉末共混并使其具有较宽粒度分布,使用球形或近球形细粉,均能提高粉末松装密度及烧结致密度;元素P能充当脱氧剂而改善润湿性,但若CuP含量多于15%质量分数,会因生成过多磷渣而降低烧结性;提高粘结金属CuSn比例能使烧结致密度得以改善,但若其含量超过30%质量分数,则会导致“球化”效应;提高混粉均匀性,有利于改善烧结致密度和组织均匀性。 A multi-component copper-based metal powder, which consists of Cu,Cu-10Sn, and Cu-8. 4P, is developed. Selective laser sintering of this powder system is processed through the mechanism of liquid phase sintering. The effects of powder characteristics such as particle shape, size distribution, chemical composition, component ratio, and dispersion homogeneity on the densification and the resultant microstructures are investiga-ted. It shows that mixing coarse and fine powder with a broad size distribution and using spherical or nearspherical fine powder can lead to an increase in the density of the loose powder and thus the densification of the laser sintered powder. The element phosphorus can act as a deoxidant to improve the wettability; however excessive addition of phosphorus (more than 15 % mass fraction of CuP) shows a negative effect on sinterability due to the formation of a large amount of phosphatic slag. With increasing the content of the binder CuSn, the sintered structure becomes denser; however, at a higher mass fraction of 30%, the "bailing" effect occurs. An improvement in the dispersion homogeneity of the powder mixture leads to a high densification with a homogenous microstructure.
出处 《航空学报》 EI CAS CSCD 北大核心 2007年第1期222-227,共6页 Acta Aeronautica et Astronautica Sinica
基金 国家自然科学基金委员会-中国工程物理研究院联合基金(10276017) 航空科学基金(04H52061) 南京航空航天大学科研创新基金(S0403-061)
关键词 粉末冶金 选区激光烧结 铜基金属粉末 液相烧结 powder metallurgy selective laser sintering copper-based metal powder liquid phase sintering phosphorus
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参考文献16

  • 1顾冬冬,沈以赴,杨家林,王洋.多组分铜基金属粉末选区激光烧结致密化机理[J].中国有色金属学报,2005,15(4):596-602. 被引量:24
  • 2Tang Y,Loh H T,Wong Y S,et al.Direct laser sintering of a copper-based alloy for creating three-dimensional metal parts[J].Journal of Materials Processing Technology,2003,140:368-372.
  • 3Das S.Physical aspects of process control in selective laser sintering of metals[J].Advanced Engineering Materials,2003,5(10):701-711.
  • 4Simchi A,Petzoldt F,Pohl H.On the development of direct metal laser sintering for rapid tooling[J].Journal of Materials Processing Technology,2003,141(3):319-328.
  • 5Zhao J F,Li Y,Zhang J H,et al.Analysis of the wear characteristics of an EDM electrode made by selective laser sintering[J].Journal of Materials Processing Technology,2003,138:475-478.
  • 6Domack M S,Baughman J M.Development of nickel-titanium graded composition components[J].Rapid Prototyping Journal,2005,11 (1):41-51.
  • 7王华明.金属材料激光表面改性与高性能金属零件激光快速成形技术研究进展[J].航空学报,2002,23(5):473-478. 被引量:85
  • 8张永忠,石力开,章萍芝,席明哲,程晶,徐骏.激光快速成形镍基高温合金研究[J].航空材料学报,2002,22(1):22-25. 被引量:30
  • 9Agarwala M,Bourell D,Beaman J,et al.Direct selective laser sintering of metals[J].Rapid Prototyping Journal,1995,1(1):26-36.
  • 10Morgan R,Sutcliffe C J,O'Neill W.Density analysis of direct metal laser re-melted 316L stainless steel cubic primitives[J].Journal of Materials Science,2004,39 (4):1195-1205.

二级参考文献47

  • 1张建华,赵剑峰,田宗军,花国然,黄因慧,胡育文.镍基合金粉末的选择性激光烧结试验研究[J].机械工程,2004,15(5):431-434. 被引量:15
  • 2顾冬冬,沈以赴,刘满仓,潘琰峰,胥橙庭.NUMERICAL SIMULATIONS OF TEMPERATURE FIELD IN DIRECT METAL LASER SINTERING PROCESS[J].Transactions of Nanjing University of Aeronautics and Astronautics,2004,21(3):225-233. 被引量:6
  • 3Das S, Beaman J J, Wohlert M, et al. Direct laser freeform fabrication of high performance metal components[J]. Rapid Prototyping Journal, 1998, 4 (3):112-117.
  • 4Zhu H H, Lu L, Fuh J Y H. Influence of binder's liquid volume fraction on direct laser sintering of metallic powder[J]. Materials Science and Engineering A,2004, 371(1-2): 170-177.
  • 5Simchi A, Petzoldt F, Pohl H. On the development of direct metal laser sintering for rapid tooling[J]. Journal of Materials Processing Technology, 2003, 141 (3): 319 -328.
  • 6Khaing M W, Fuh J Y H, Lu L. Direct metal laser sintering for rapid tooling: processing and characterisation of EOS parts[J]. Journal of Materials Processing Technology, 2001, 113(1 - 3): 269 - 272.
  • 7ZHAO Jian-feng, LI Yue, ZHANG Jian-hua, et al. Analysis of the wear characteristics of an EDM electrode made by selective laser sintering[J]. Journal of Materials Processing Technology, 2003, 138(1 - 3): 475 - 478.
  • 8Pintsuk G, Brunings S E, Doring J E, et al. Development of W/Cu-functionally graded materials[J]. Fusion Engineering and Design, 2003, 66- 68: 237-240.
  • 9Engel B, Bourell D L. Titanium alloy powder preparation for selective laser sintering[J]. Rapid Prototyping Journal, 2000, 6(2): 97 - 106.
  • 10Simchi A, Pelzoldt F, Pohl H. Direct metal laser sintering: material considerations and mechanisms of particle bonding[J]. The International Journal of Powder Metallurgy, 2001, 37(2): 49 - 61.

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