摘要
研究了焊接热模拟工艺参数t8/5对微钙钢焊接粗晶热影响区(CGHAZ)显微组织和冲击韧度的影响。利用Lepera试剂腐蚀法,采用光学金相显微镜、透射电子显微镜分析了不同t8/5条件下粒状贝氏体中M-A组元的形态及分布特征。研究结果表明当冷却速度较快时,M-A组元主要以长条状、呈方向性分布;当冷却速度降低时,M-A组元逐渐变成颗粒状,并失去方向性;当t8/5=40 s时,韧性较好。
The effects of technology parameters of simulated welding thermal cycle(cooling time t8/5) on microstructures and impact toughness of CGHAZ in micro-colcium steel were studied.The M-A constituents in granular bainite were etched by Lepera reagent.The pattern,quantity and distribution of M-A constituents with different t8/5 were studied in optical microscope and TEM.The research shows that when the cooling rate is lower the M-A constituents are bacillary and directional,when the cooling rate is higher the M-A constituents are granular and direction-free.When t8/5=40 s the impact toughness is better than other cooling time.
出处
《焊接学报》
EI
CAS
CSCD
北大核心
2007年第2期95-98,共4页
Transactions of The China Welding Institution
关键词
热模拟
粒状贝氏体
M—A组元
韧性
simulated welding thermal cycle
granular bainite
M-A constituents
toughness
