期刊文献+

微型梳状线振动陀螺仪的特性研究

Research on characteristic and emulation of MEMS comb line vibration gyroscope
下载PDF
导出
摘要 硅微陀螺仪是微机电系统研究的一个重要内容,由于其体积小(达到微米级别),许多在传统陀螺仪中忽略掉的干扰条件要重新进行评估。其中,温度对其性能的影响很大。本文通过分析温度对梳状线振动陀螺仪的影响,推出了检测轴输出幅值和相位与温度的关系。提出一种利用输出相位作为温度补差的新方法,经温度实验验证了这种方法的可行性,此方法为提高微型梳状线振动陀螺仪的性能提供了一种新的途径。 Silicon-MEMS gyroscope is an important part of MEMS. Due to its small size ( in the range of microns) some disturb factors that were ignored in traditional gyroscope must be evaluated again. Among these disturb factors the temperature change has great influence on the performance of MEMS gyroscope. The temperatures change influence is analyzed and the relationship between the magnitude and phase of the measurement axis and temperature was derived. A new method is proposed, which uses the output phase to compensate the temperature influence. Temperature experiment proves the feasibility of the method. It provides a new approach for improving the characteristic of MEMS comb line vibration gyroscope.
出处 《仪器仪表学报》 EI CAS CSCD 北大核心 2007年第2期352-356,共5页 Chinese Journal of Scientific Instrument
关键词 硅微陀螺仪 梳状线振动 温度特性 silicon MEMS gyroscope comb line vibration temperature characteristic
  • 相关文献

参考文献2

二级参考文献6

  • 1杨拥军 赵正平 梁春广.微机械电子隧穿传感器及其在航天技术中的运用[J].声光与压电,2001,23.
  • 2[1]YAZDI, NAJAFI K. An all-silicon single wafeffabrication technology for presicion micro-accelerometers [M] (Transducers'97), 1997, 1181-1184.
  • 3[2]YAZDI N, AYAZI F, NAJAFI K. Micromachined Inertial Sensors [J] . Proc of IEEE, 1998, 86: 1640-1659.
  • 4[3]CHABLOZ. A method to evade microloading effect in deep reactive ion etching for anodically bonded glass-silicon structures [M] . (MEMS'00), 2000, 283-287.
  • 5[4]HARMAN G G, LEEDY K O. An experimental model of the microelectronic ultrasonic wire bonding mechanism [C] Proceedings of the 10th Annual Conference on Reliability Physics 1972 New York, NY, USA: IEEE, 1972, 49-56.
  • 6[5]GABRIELSON T B. Mechanical-thermal noise in micromachined acoustic and vibration sensors [J] . IEEE Trans. Electron Devices, 1993, 40: 903-909.

共引文献15

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部