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深亚微米nMOSFET器件的总剂量电离辐射效应 被引量:3

Total Ionizing Dose Effects of Deep Submicron nMOSFET Devices
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摘要 选取了采用0.25μm工艺的两组器件进行研究.通过对这两种器件关态泄漏电流、跨导和栅电流等电学参数进行分析,得出当器件发展到深亚微米阶段时,影响其辐射效应的主要原因是场氧化层中的陷阱电荷.并对相关机理进行了分析和仿真验证. We study the total ionizing dose sensitivity of 0.25μm nMOSFETs. The off-state leakage current, transconductance,and the gate leakage current of the devices are monitored. Experiment shows that the effect on irradiation is mostly caused by the space charges in the field oxide,which is verified by simulation.
出处 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2007年第2期241-245,共5页 半导体学报(英文版)
基金 国家自然科学基金资助项目(批准号:60376024)~~
关键词 X射线 辐射 总剂量效应 关态泄漏电流 X-ray irradiation total dose effect off-state leakage current
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参考文献8

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