膨胀珍珠岩-玻璃微珠复合制品试验研究

Experimental study on expanded perlite/glass bead composites

使用自行研制的SPG复合粘结剂对膨胀珍珠岩-玻璃微珠复合制品的制备进行了初步试验研究。结果表明,由于空心玻璃微珠可填充膨胀珍珠岩颗粒之间的较大孔隙,使导热系数比普通珍珠岩制品有较大幅度的下降,使用温度也有所提高。在本试验条件下所制实验室样品25℃的导热系数为0.048 W(/m·K),500℃导热系数为0.101 W(/m·K),制品的抗压强度为1.21 MPa,抗折强度为0.43 MPa,体积密度为195 kg/m3,800℃、3 h烧后线收缩率不大于1.5%。

Preliminary test and study were made on preparation of expanded perlite and glass bead composites with complex binder SPG prepared in our lab. The results of experiment indicate that the hollow glass bead can fill larger pores among expanded perlite particles, so the thermal conductivity of composites is much lower than that of normal perlite products and its service temperature is higher. The thermal conductivity of lab samples prepared under experiment conditions is 0.048 W/（m·K） at 25℃ and 0.101 W/（m·K） at 500℃, the compression strength is 1.21 MPa and the rupture strength is 0.43 MPa, the bulk density is 195 kg/m^3, the linear shrinkage sintered at 800℃ for 3 h is below 1.5%.