摘要
采用统计过程控制(SPC)技术,提高微电路产品的质量和可靠性,监控键合工序的生产过程状态。通过连续采集的25批键合强度数据,绘制了标准-偏差控制图,并对控制图处于非受控状态的批次进行了具体分析。根据分析结果,改进工艺方法,使生产过程处于受控状态。
Statistical process control （SPC） technique is used to improve quality and reliability of rnicroelectronic products, and monitor production conditions of wire bonding process. Based on 25 lots of successively collected data, a standard-deviation control chart is plotted, and process lots in out-of-control state on the control chart are analyzed. Based on the results, processes are improved to ＇bring the production process under control.
出处
《微电子学》
CAS
CSCD
北大核心
2007年第1期38-40,44,共4页
Microelectronics
关键词
统计过程控制
键合
受控状态
工序能力指数
Statistical process control
Wire bonding
Controlled state
Process capability index
