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背腐蚀法分离p-n结的研究

STUDY ON THE p-n JUNCTION SEPARATION BY BACK ETCHING
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摘要 采用正面无保护的背腐蚀方法分离p-n结,用SEM图观察了背腐蚀后硅片表面形貌的变化,对背腐蚀与刻边分离p-n结样品的光生电动势进行了比较,用能带理论对其差别做了深入的解释。 Separating p-n junction by using of back etching method without surface protect was studied, also the surface by SEM pictures. The photo-induced voltage between the back etching and edge etching silicon were compared, explaining the difference by means of the theory of energy bands.
出处 《太阳能学报》 EI CAS CSCD 北大核心 2007年第2期165-168,共4页 Acta Energiae Solaris Sinica
基金 上海市科委项目"高效多晶硅太阳电池关键技术及中试研究"的奖金支持项目(03DZ12028)
关键词 背腐蚀 光生电动势 能带 back etching photo-induced voltage energy bands
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参考文献7

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