电镀银镍合金工艺及其在电接触材料生产中的应用

Electroplating process of silver-nickel alloy and its application to the production of electrical contact materials

介绍了用于生产电接触材料的银镍合金电镀工艺。镀液配方为：30～80g／LKAg（CN）2，10～30g／LKCN，10～20g／LK2CO3，0．2～0．3g／LCdSO4，0．1～0．2g／L糖精，100～150g／L络合剂Ⅱ，5～10g／L镍盐，1～2g／LK2SeO3。介绍了镀液中各组分的作用、镀液的维护及杂质影响与去除方法。讨论了镀液中各组分的含量及工艺条件（温度、电流密度、搅拌方式）对镀液和镀层性能的影响。该工艺操作简单，工艺范围宽，电流效率高，沉积速度快。

An electroplating process of Ag-Ni alloy for production of electrical contact materials was presented. The electroplating bath is composed of 30 - 80 g/L KAg（CN）2, 10-30 g/L KCN, 1 0 - 20 g/L K2CO3, 0.2 - 0.3 g/L CdSO4, 0. 1 0.2 g/L saccharin, 100 - 150 g/L complexing agent II, 5 l0 g/L nickel salt and 1- 2 g/L K2SeO3. The role of individual component in the bath, bath maintenance, effects of impurities on the bath and coating properties and methods for removing impurities were introduced. The effects of the dosage of individual component in the bath and technological conditions （temperature, current density and agitation method） on the bath and coating properties were discussed. The process features simple operation, wide operating range, high current efficiency and fast deposition speed.