金沉积基底不同表面处理对金瓷剪切强度的影响

Effects of different surface treatments on bond strength of porcelain fused to electroformed copings

目的研究金沉积基底不同表面处理条件对金瓷结合强度的影响。方法制作45个柱形镍铬合金试件,表面电镀形成金沉积帽状基底,随机分成5组,50μm、110μmAl2O3喷砂组,50μm喷砂+金黏结剂组、110μm喷砂+金黏结剂组及对照组,通过剪切实验测试金瓷结合强度。结果使用金黏结剂组的金沉积基底与瓷的结合强度为最高,喷砂组次之,对照组最小,差异有显著性(P<0.05);金黏结剂组、喷砂组之间结合强度无显著性差异。结论喷砂和金黏结剂能增强金沉积基底与瓷的结合强度。

Objective To determine the effects of different surface treatrnents on bond strength of porcelain to electroformed gold copings. Methods Forty-five cylindrical Ni-Cr alloys were made, and gold copings were deposited on them and divided into 5 groups randomly. After different surface treatments were taken on round gold surface, including 50 tan AI203 sand blasting, 110 tan Al2O3 sand blasting, gold bonder applying after 50 μm Al2O3 sand blasting, gold bonder applying after 110 μm Al2O3 sand blasting, and no treatment as control, the gold cophags received two layers of opaque and two layers of body porcelain. Shear tests were peffonncd in a universal testing machine. Results The mean shear bond strength values were： 9.04 MPa, 9.80 MPa, 12.19 MPa, 12.86 MPa, 6.99 MPa.The one-way ANOVA showed significant differences among the groups（ P 〈 0.01 ）. Conclusions The gold bonder and sand blasting can significantly improve the bond strength of porcelain fused electrofonncd pure gold copings.