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嵌入式SoC总线分析与研究 被引量:7

The Analyse And Research of embeded SoC Bus
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摘要 本文主要介绍和分析了在集成芯片设计中几种常用的片上系统总线-CoreConnect总线、AMBA总线、Wishbone总线和OCP总线,通过比较这些总线的特性及适用范围,展望了它们的发展前景。 In this paper, the OCB of CoreConnect, AMBA(Advanced Microcontroller Bus Architecture), Wishbone, OCP(Open Core Protocol) are mainly introduced and analyzed. By comparing the characteristic and the applied scope of these SoC bus, the paper views the foreground of the SoC bus mentioned above.
出处 《中国集成电路》 2007年第3期45-49,67,共6页 China lntegrated Circuit
关键词 IP SOC 片上总线 集成芯片 IP SoC OCB(On-Chip Bus)
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参考文献2

  • 1[5]Patrick Pelgrims,Tom Tierens and Dries Driessens.Overview AMBA Avalon CoreConnect Wishbone[EB/OL].http://www.opencont entorg/openpub/.
  • 2[7]Rudo Usselmann.OpenCores SoC Bus Review.http://www.opencores.org.January,2001

同被引文献46

  • 1王国章,须自明,刘战,于宗光.SoC芯片验证技术的研究[J].微计算机信息,2007,23(23):132-133. 被引量:9
  • 2蔡艳辉,胡锐,程鹏飞,杨云春,王权.一种基于FPGA+DSP的北斗兼容型高精度接收机系统设计[J].导航定位学报,2013,1(2):1-6. 被引量:9
  • 3颜伟成,陈朝阳,沈绪榜.AMBA-AHB总线接口的设计与实现[J].计算机与数字工程,2005,33(10):130-132. 被引量:6
  • 4ANDREWS J R. Coverification of hardware and software for ARM SoC design[ M]. America Elsevier Inc, 2005:200.
  • 5PASRICHA S, DUTTN, BEN-ROMDHANE.M. Using TLM for exploring bus-based SoC architectures application-specific systems [C]//2005 16th IEEE International Conference. [S.l.]:[s.n.], 2005: 79-85.
  • 6MARANINCHI F, MOY M, CORNET J, et al. IemC/TLM semantics for heterogeneous syslemon-chip validation[C]//2008 International Conference on Cireuits and Systems and TAISA. [S.l.]:[s.n.], 2008:281-284.
  • 7PASRICHA S. Transaction level modeling of SoC using systemC 2.0 [C]//Synopsys User Conference' 02. Bangalore: KluwerAcademic Group Publishers, 2002:11-15.
  • 8ARM Limited. AMBA specification [EB/OL]. [ 2004-07-30]. http://www.arm, com.
  • 9李建成,庄钊文,张亮.SOC设计的软硬件协同验证研究[J].半导体技术,2007,32(10):904-908. 被引量:4
  • 10LEE C, BAEK S H, PARK K H. A hybrid flash file system based on NOR and NAND Flash memories for embedded devices[ J]. IEEE Transactions on Computers, 2008, 57(7) : 1002 - 1008.

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