交流电诱发铜互联体的热疲劳失效行为及微观分析

Alternating current-induced thermal fatigue failure of Cu interconnects and microscopic analysis

本文报道了铜互联体布线在交流电作用下产生的一种新的热疲劳失效行为,通过透射电子显微镜对热疲劳损伤部位的研究,并与纯机械疲劳载荷作用下的铜薄膜损伤行为进行比较,分析了铜互联体热疲劳损伤失效机理。

This paper reports a new failure behavior of Cu interconnects under thermal fatigue loading generated by alternating currents. Thermal fatigue damage behavior of the Cu interconnects was investigated by transmission electron microscopy （TEM）, and a comparison of thermal fatigue behaviors and mechanical fatigue behaviors was conducted. The mechanism of thermal fatigue failure of the Cu interconnects was analyzed.