超声功率对电化学沉积铜过程速率的影响

Effect of ultrasonic power on the processing rate of copper electrodeposition

测定了H_2SO_4-CuSO_4溶液中,超声频率为24kHz时,超声功率对铜电化学阴极沉积过程速率的影响。实验结果表明,在超声作用下铜电化学阴极沉积过程的电流密度明显提高,即超声作用能提高过程的沉积速率。超声对铜电化学沉积过程速率强化程度随超声功率的增加而增大;在相同温度和超声功率下,超声强化速率的效果从反应控制区域(低操作过电位)向传质控制区(高操作过电位)过渡时而更加显著;在其它条件相同的情况下,超声对铜电化学沉积过程速率的强化程度随温度的升高析减小;超声强化速率的效果与溶液中铜离子的浓度基本无关。

Effects of ultrasonic power with a frequency of 24kHz on the processing rate of copper electrodeposition in H2SO4-CuSO4 solution are investigated. The experimental results show that the current densities can be improved by ultrasound. The ratio of the current density with ultrasound to that without, is increased on increasing the ultrasonic power, is enhanced from the kinetic-controlled reaction range （at low over-potential） to the mass-transfer-controlled range （at high over-potential）, is decreased on increasing the operating temperature and is independent of the concentration of copper ion in solution during the electrodeposition of copper.