摘要
利用颗粒增强原理研制了新型Ag颗粒增强SnCu基复合钎料,研究了Ag颗粒不同含量对复合钎料性能影响．结果表明:当Ag含量(体积分数)为5%时,复合钎料铺展面积最大,润湿角最小,钎焊接头蠕变寿命最长,比基体钎料提高23倍．
Based particle-enhancement principle, a novel Ag particle-enhancement SnCu based composite solder was formed by adding Ag particles into SnCu solder. The influence of different contents of Ag particles on properties of SnCu based composite solder was investigated. Results indicate that the spreading area of the composite solder with 5% Ag particles is largest, the wetting angle smallest, and its creep rupture life longest, which is 23 times more than one of the matrix solder at the same experimental condition. So 5% is the optimal content of Ag particles among Ag particle -enhancement SnCu based composite solders. metallic materials, Ag particles, creep rupture life, composite solder, particle-enhancement
出处
《材料研究学报》
EI
CAS
CSCD
北大核心
2007年第1期102-106,共5页
Chinese Journal of Materials Research
基金
河南科技大学基金13420060
洛阳高新先科液压技术有限公司项目6142004资助.
关键词
金属材料
Ag颗粒
蠕变寿命
复合钎料
颗粒增强
metallic materials, Ag particles, creep rupture life, composite solder, particle-enhancement
