2,2′-联吡啶和亚铁氰化钾对乙醛酸化学镀铜的影响

Effect of 2,2′-dipyridyl and K_4Fe(CN)_6 on Electroless Copper Plating Using Glyoxylic Acid as Reducing Agent

以乙醛酸作还原剂、Na2EDTA为络合剂、2,2′-联吡啶和亚铁氰化钾作为添加剂组成化学镀铜体系,研究了两种添加剂对化学镀铜速率、镀层表面形貌、组成和结构的影响.结果表明:添加适量的2,2′-联吡啶和亚铁氰化钾,不仅提高了镀液的稳定性,而且使沉积速率增加1倍.这两种添加剂的同时使用,使镀层颜色变亮,形貌发生变化.所得镀层是多晶铜,没有发现夹杂Cu2O.

The electroless copper plating was studied in a bath consisting of glyoxylic acid as reducing agent, Na2EDTA as complexing agent, both 2,2＇-dipyridyl and K4 Fe （CN）6 as additives, focused on the influence of the additives on the deposition rate, as well as on the composition, structures and surface morphology of the deposits. It was found that adding an optimum amount of 2,2＇ -dipyridyl and K4Fe（CN）6 to the bath will not only improve the stability of the bath , but also increase the deposition rate by 100 %. The simultaneous addition of both additives causes the deposits to bright appearance and the change in morphology. The deposits were proved to be polycrystalline copper, in which no Cu2O was detected.