高精细抛磨工艺研究

Study on Highfine Polishing Technology

针对磨削机理与砂带磨削机理的相似性,提出了一种新型的高精细抛磨工艺方案.采用新型胶带砂纸,通过试样抛磨机进行抛磨试验.经研究试验证实:在同等磨削力的作用下,由于新型胶带砂纸具有软弹性,多磨粒,且粒径小,排列紧致细密,因此磨削中的发热量小,不会产生新的形变层.将普通砂纸和新型胶带砂纸对模具常用材料Cr12进行抛磨试验的数据绘制成曲线图,并进行分析与比较得知,用新型胶带砂纸抛磨后的表面精度比普通抛磨工艺加工提高二至三个等级,达到高精细精度.

In view of the similarity between the grinding mechanism and sand stripping mechanism,a new kind of plan for the soft highfine polishing is proposed. There is researching experiment which is between test - massive polishing machining and new adhesive tape sandpaper. It is confirmed that on the same grinding level under the action of force, the temperature is much lower and will not produce the new distortion layer in processing because of soft elasticity, muhiparticeles, the size minimum of abrasive grain, permutation is tight and close, of the new type of sandpaper. The machined surface finish degree can be increased by 2 - 3 precision class compared with the ordinary, the obtained data from researching experiment is almost the same precision class with overseas supplier providers, and achieve highfine result. This kind of new technology can be widely applied to all kinds of mechanical products, particularly in molding manufacturing industry.