芯片电子封装翘曲非线性有限元分析

Nonlinear finite element analysis on electronic chip package warpage

针对芯片电子封装翘曲主要是由各种部件材料性能与几何尺寸不匹配,以及封装过程中温度分布不均匀性引起的问题,在只考虑材料属性的前提下,将不同的基板材料和环氧模塑封装材料(Epoxy Molding Compound,EMC)进行组合,运用有限元软件MSC Patran/Nastran研究不同组合工况对封装翘曲的影响.研究表明,当封装材料与基板材料的属性相差较大时,会发生大的向上翘曲;当两者材料属性相差较小时,向上的翘曲值较小;但当两者材料属性过于趋近时,会发生向下翘曲的情况.

According to the fact that the electronic chip package warpage problems are mainly caused by mismatch of material properties and geometric structure of each component, and inhomogeneous temerature in molding process, the different materials of lead-frame and Epoxy Molding Compound （EMC） are assembled considering material properties merely. The influence on warpage under different compoundings are discussed by finite element analysis softwares MSC Patran/Nastran. It is obtained that warpage is greatly upward if the material properties between lead-frame and EMC are rather different, a little upward if the property difference is small, and downward if the property difference is on the rather small side.