工业牵引应用的采用软穿通IGBT技术的大功率模块

High-Power Modules with Soft-Punch-Through IGBT Technology fo Traction Applications

随着采用1700V-SPT(软穿通)IGBTLoPak密集型封装结构模块类型,和为了进一步开发利用新的1700V-SPTIGBT和二极管芯片的特性,出现了新的封装类型的模块:即电压1700V,电流额定值为2400A,封装形式为"E1"和"E2"工业标准模块。我们在长期高可靠性应用的经验基础上,设计了新的封装类型,其特性适用于牵引市场。在本文中,讨论了1700V-SPTIGBT(E1/E2)模块范围的特性,尤其论述了改进的静态和动态特性。

Following the successful introduction of the 1700V SPT-IGBT LoPak module range, and in order to further exploit the performance benefits of the new 1700V SPT-IGBT and diode chips, the new range of 1700V ＂E1＂ and ＂E2＂ industry standard modules rated up to 2400A is presented here. The new package range is designedwith characteristics suited for the traction market based on our long experience in high reliability applications. Inthis paper, the performance of the new 1700V SPT-IGBT [E1/E2] module range is discussed, with particularreference to the improved static and dynamic performance.