摘要
介绍用红外热像仪检测半导体功率管管壳焊料烧接质量,采用计算机数字图像处理技术对焊接缺陷形成的热图像进行分割处理,提取缺陷的形状、位置、大小等若干特征参数的方法。
Thermal imaging system had used to detect welding defects in semiconductive power device metal package. The data were processed with a digital image method to segment the shape,position and size of the detects and to extract the feature parameters.
出处
《红外技术》
CSCD
1996年第5期43-45,F003,共4页
Infrared Technology