期刊文献+

横向负载下三维微触觉传感器的力学模型 被引量:4

Mechanical Module of 3D Micro Tactile Sensor Under Transverse Load
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摘要 提出了一种用于微结构几何量测量的MEMS三维微触觉式传感器在横向负载下的力学模型,用于指导传感器的设计和优化.对传感器的整体刚度、敏感梁的应力分布、检测灵敏度及线性灵敏度进行了计算.利用ANSYS有限元仿真方法模拟了传感器的应力分布,分布曲线与理论曲线的偏差小于3.870/0,最大应力的仿真和理论偏差小于3.630/0.通过一个已完成传感器的性能标定,灵敏度的实验和理论误差为7.790/0,实验值线性误差为0.20/0. To design and optimize a 3D micro electro-mechahical system(MEMS) micro tactile sensor for dimension measurement of micro structure, a mechanical module of sensor under transverse load is presented, The stiffness of sensor, stress distribution of beam, sensitivity, and linearity of sensor are calculated, By ANSYS finite element method, the stress distribution on beam is simulated, and the error between simulated curve and theoretic one is less than 3.87%, the error between maximum stress simulated and theoretic stress is less than 3.63%. By means of performance calibration of a finished sensor, the error between theoretic and experimental sensitivities is 7.79%, and linear error of experimental result is 0.2%.
出处 《纳米技术与精密工程》 EI CAS CSCD 2007年第1期6-10,共5页 Nanotechnology and Precision Engineering
关键词 微结构尺寸测量 微机电系统 微触觉传感器 力学模型 横向负载 dimension measurement of micro structure micro electro-mechanical system (MEMS) micro tactile sensor mechanical modules transverse load
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参考文献6

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二级参考文献1

共引文献6

同被引文献21

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