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冷却速率对无铅钎料和焊点质量影响 被引量：4

Research of Effect of Cooling Rate on Lead-free Solder and Solder Joint Quality
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摘要 阐述了再流焊冷却速率对无铅钎料和焊点质量的影响的研究现状。已有的研究结果表明:冷却速率对于无铅钎料的微观组织、拉伸性能、金属间化合物的形态和尺寸以及焊点中的凝固缺陷等都有显著的影响。选择合适的冷却速率可以提高焊点质量。 Introduce the research of effect of cooling rate on the lead - free solder and solder joint quality. The current research indicates that cooling rate has prominent effects on microstructure and tensile properties of lead - free solders, the morphology and thickness of intermetallic compounds, and solidification defects in lead - free solder joints. It is important to tailor cooling rate to improve solder joint quality.
作者 张彬彬 王春青
机构地区 哈尔滨工业大学现代焊接生产技术国家重点实验室
出处 《电子工艺技术》 2007年第2期71-73,77,共4页 Electronics Process Technology
关键词 冷却速率 无铅钎料 焊点质量 Cooling rate Lead - free solder Solder joint quality
分类号 TN604 [电子电信—电路与系统]
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参考文献14

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  • 3Shen Jun,Liu Yong-chang,Han Ya-jing et al.Effects of cooling rates on microstructure and microhardness of lead-free Sn-3.5% Ag solders[J].IEEE transactions on nonferrous met Soc China,2006(16):59 -64.
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二级参考文献40

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共引文献46

同被引文献18

引证文献4

二级引证文献32

电子工艺技术
2007年 第2期

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