期刊文献+

永磁微加速度开关设计与仿真 被引量:4

Modeling and simulation of a micro magnetic acceleration switch
下载PDF
导出
摘要 基于永磁铁磁力随位移的非线性变化特性,提出了一种新型磁力微加速度开关设计方案.建立了含有永磁力、气膜阻尼力、表面接触力、惯性力的开关系统动力学分析模型,给出了质量块在开关多种工作状态下的运动微分方程.对开关工作过程中质量块位置、永磁力、空气阻尼力、质量块与触点接触力等参数的变化规律进行了仿真,结果表明:该设计可以受控于加速度门限完成闭合-断开功能;微开关系统阻尼由质量块与封装外壳间隙厚度决定,为一变阻尼系统;开关闭合时电接触可靠性取决于质量块对触点的压力;开关闭合和截止所需的激励加速度门限值受永磁铁磁力和支撑梁刚度参数的控制. According to the characteristic that the force between a permanent magnetic couple changes nonlinearly with the magnetic displacement, a novel micro acceleration-switch of permanent magnetic force is designed. The dynamic model for the micro switch including the permanent magnetic force, the gas damping force, the contact force and the inertia force is established. The motion differential equations for the mass in several work conditions are presented. The law of the variation of the mass position, the permanent magnetic force, the gas damp force, the contact force between the mass and the contactors in switch work condition is simulated. Results indicate that the micro switch is a damp-varying system and that the damp is determined by the gas between the mass and the encapsulation. The reliability of electrical contact depends on the pressure between the mass and the contactor. The acceleration threshold of the switch is controlled by such parameters as magnetic force and stiffness of the micro cantilever.
出处 《西安电子科技大学学报》 EI CAS CSCD 北大核心 2007年第2期285-289,共5页 Journal of Xidian University
基金 国家自然科学基金NASF联合基金(10476019)
关键词 微电子机械系统 微加速度开关 永磁力 空气阻尼 表面接触力 micro-electro-mechanical system(MEMS) micro acceleration switch permanent magnetic force gas damp surface contact force
  • 相关文献

参考文献10

  • 1Michaelis S,Timme H J,Wycisk M,et al.Additive Electroplating Technology as a Post-CMOS Process for the Production of MEMS Acceleration-threshold Switches for Transportation Applications[J].Journal of Micromechanics and Microengineering,2000,10(2):120-123.
  • 2Ma W,Zohar W,Wong M.Design and Characterization of Inertia-activated Electrical Micro-switches Fabricated and Packaged Using Low-temperature Photoresist Molded Metal-electroplating Technology[J].Journal of Micromechanics and Microengineering,2003,13(6):892-899.
  • 3Sabariego R V,Gyselinck J,Dular P,et al.Coupled Mechanical-electrostatic FE-BE Analysis with FMM Acceleration:Application to a Shunt Capacitive MEMS Switch[J].The International Journal for Computation and Mathematics in Electrical and Electronic Engineering,2004,12(23):876-884.
  • 4Akoun G,Yonnet J.3D Analytical Calculation of the Forces Exerted Between Two Cuboidal Magnets[J].IEEE Trans on Magnetics,1984,20(5):1 962-1 964.
  • 5徐泰然.MEMS和微系统--设计与制造[M].北京:机械工业出版社,2004.
  • 6Van Kampen R P,Wolffenbuttel R F.Modeling the Behavior of Bulk-micromachined Silicon Accelerometers[J].Sensors and Actuators,1998,64(2):137-150.
  • 7Griffin W S,Richardson H H,Yamanami S.A Study of Squeeze Film Damping[J].ASME Journal of Basic Engineering,1966,(6):451-456.
  • 8田文超,贾建援.接触问题连续介质理论修正研究[J].中国机械工程,2004,15(1):14-17. 被引量:6
  • 9Timoshenko S,Goodier J N.弹性理论[M].北京:高等教育出版社,1990:489-495.
  • 10Pruitt B L,Park W T,Kenny T W.Measurement System for Low Force and Small Displacement Contacts[J].Journal of Microelectromechanical System,2004,13(2):220-229.

二级参考文献1

共引文献10

同被引文献34

引证文献4

二级引证文献22

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部