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高性能InGaAs/AlAs共振隧穿二极管的研制与器件模拟分析 被引量:1

Fabrication and Device Simulation of High Performance InGaAs/AlAs Resonant Tunneling Diodes on InP Substrates
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摘要 在半绝缘的InP衬底上采用分子束外延的方法生长制备了不同势垒厚度的RTD材料样品,室温下测量的最高峰-谷电流比为18.39.通过模拟得到RTD直流特性与势垒厚度、势阱材料及厚度、隔离层厚度以及掺杂浓度间的关系,对结果进行了分析与讨论. Resonant tunneling diodes (RTDs) with different barrier thicknesses were grown by molecular beam epitaxy (MBE) on semi-insulating InP substrates. The highest peak-to-valley current ratio is 18.39 at room temperature. The relationship between RTD direct current characteristics with barrier thickness,well and sub-well thickness,spacer thickness, and doping density are analyzed and discussed.
出处 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2007年第4期563-566,共4页 半导体学报(英文版)
基金 国家高技术研究发展计划资助项目(批准号:2003AA302750)~~
关键词 共振隧穿二极管 峰-谷电流比 电流-电压特性 器件模拟 resonant tunneling diodes peak-to-valley current ratio current-voltage characteristics device simulation
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参考文献8

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