摘要
在半绝缘的InP衬底上采用分子束外延的方法生长制备了不同势垒厚度的RTD材料样品,室温下测量的最高峰-谷电流比为18.39.通过模拟得到RTD直流特性与势垒厚度、势阱材料及厚度、隔离层厚度以及掺杂浓度间的关系,对结果进行了分析与讨论.
Resonant tunneling diodes (RTDs) with different barrier thicknesses were grown by molecular beam epitaxy (MBE) on semi-insulating InP substrates. The highest peak-to-valley current ratio is 18.39 at room temperature. The relationship between RTD direct current characteristics with barrier thickness,well and sub-well thickness,spacer thickness, and doping density are analyzed and discussed.
基金
国家高技术研究发展计划资助项目(批准号:2003AA302750)~~
关键词
共振隧穿二极管
峰-谷电流比
电流-电压特性
器件模拟
resonant tunneling diodes
peak-to-valley current ratio
current-voltage characteristics
device simulation