喷射成形70Si30Al合金封装材料的组织性能研究

Microstructures and Properties of Sprayformed 70Si30Al Alloy Packaging Material

利用喷射成形技术制备了70Si30Al合金新型电子封装材料,研究了材料沉积态、热压态的显微组织演变规律,测试了材料的各项性能。结果表明:沉积态材料显微组织细小均匀,一次Si相尺寸大约在10-40μm左右,且均匀弥散分布。经过热压后,材料的热膨胀系数为7×10-6-9×10-6K-1,热导率可以达到120 W.m-1.K-1。

A novel 70Si30Al alloy packaging material for electronic applications was prepared by sprayforming technology. The microstructures of the as-sprayformed and the as-hot-pressed samples were studied. The properties were also studied. The results showed that Si phase was fine and dispersed, the microstructure of preforms from spray forming was fine and homogeneous, the coefficient of thermal expansion （CTE） was 7 × 10^-6 - 9 × 10^-6 K^-1, and the thermal conductivity can reach up to 120 W·m^-1·K^-1.