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多芯片组件电磁干扰频谱中的两次峰值问题研究

Analysis of electromagnetic interference spectrum in multichip modules
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摘要 首先采用Thevenin端接方法对多芯片组件(MCM)电路进行阻抗匹配,然后通过建立等效电路仿真模型,研究其电磁干扰频谱中的两次峰值问题．模拟结果表明,第一个峰值频率随负载电容和寄生电容的增大而减小;第二个峰值频率随负载电容和电阻的增大而减小;两个峰值高度分别随负载电容的增大而增大或减小,且当负载阻抗接近传输线特性阻抗时,两个峰值高度均有所下降．仿真结果与MCM中两种瞬态电流引起的电磁干扰分析结果一致． The paper presents the Thevenin termination technique, which can be used in the analysis of electromagnetic interference frequency spectrum in multichip modules（MCM）. Based on the equivalent circuit model of MCM, the simulation results are obtained on relations of peak frequency and amplitude to load impedance and parasitic capacitance. Moreover, the calculated results of two types of transient currents in MCM are introduced to validate the simulations. All the presented results are valuable in practical applications.
作者 徐如清 畅艺峰 杨银堂
机构地区 西安电子科技大学微电子所宽禁带半导体材料与器件教育部重点实验室
出处 《兰州大学学报（自然科学版）》 CAS CSCD 北大核心 2007年第2期80-83,共4页 Journal of Lanzhou University(Natural Sciences)
基金 国家自然科学基金(60606006).
关键词 多芯片组件 Thevenin端接 仿真 multichip module Thevenin termination simulation
分类号 TN405.97 [电子电信—微电子学与固体电子学]
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参考文献10

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共引文献5

兰州大学学报（自然科学版）
2007年 第2期

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