摘要
胶囊内窥镜是近年发展起来的微型医疗仪器,其电路构造具有体积小、功能全等特点。文章提出用高密度封装SiP技术实现胶囊内窥镜的电路系统微型化。相对传统的芯片定制方式,采用堆叠式、表面贴装式或倒装焊式等组装方式具有成本低、难度低、开发周期短的优点。SiP封装、埋植式元件基板制造等高密度封装技术的不断发展,使得采用普通商用芯片实现胶囊内窥镜电路系统制造具有可行性。
Capsule endoscope is a micro medical instrument which embodies the whole wireless signal transmission system in a small volume. This paper proposes micro system manufacturing with high density packaging technology of SiP. Comparing to the traditional manufacture approach of chip customization, the SiP packaging approach has the benefits of low-cost and short development process. The development of SiP technology and embedded passives in substrate technology make the micro circuit system of capsule endoscope with commercial chips feasible.
出处
《电子与封装》
2007年第4期6-9,共4页
Electronics & Packaging
关键词
胶囊内窥镜
高密度封装
SIP
埋植式元件
capsule endoscope
high density packaging
SiP
embedded passives in substrate
