面板显示驱动电路的失效分析及对策

Analysis of Panel Display Drive IC Failure and Countermeasure

文章主要对集成电路失效问题进行分析,列举出了容易引起集成电路失效的原因:压焊劈刀选型不当,生产过程中造成芯片表面沾污,芯片表面内压焊点铝层与底层硅化合物结合不牢,选用压焊参数不当,环氧塑封料的特性不佳,存储环境恶劣导致成品电路吸潮等,并逐一进行了分析。同时,还简要的对环氧塑封料特性:耐热性、耐腐蚀性、热膨胀系数、电气特性、耐湿性、结合力方面引起集成的电路失效进行了进一步的分析,提出了预防因产品吸潮而引起塑封体与芯片表面产生分层造成集成电路失效的方法。

With the rapid development of semiconductor packaging in China, it becomes more and more important to study the subject that why IC fails in the early production .This thesis narrates some causes of IC failure in detail ,which including ：wrong selection of capillary ,chip＇s surface pollution in production, aluminum lift, erroneous bonding parameters ,defective epoxy molding compound （EMC）, moist stored circumstance and so forth .In addition ,it also analyses the properties of EMC： thermal endurance, corrosion stability, coefficient of thermal expansion （CTE）, electricity attributions, humidity resistance, bonding force, which are known to have deleterious effects on IC validity. According to these effects, it advances some methods to prevent IC from moisture absorption and thereby improve IC encapsulation yield.