摘要
采用粉末冶金与电子束熔炼法制备纯钽锭坯，坯料经过锻造、轧制成0．3mm板材，测定了2种方法制备的纯钽的再结晶温度，研究了不同再结晶退火工艺对晶粒大小及其深冲性能的影响。结果表明，粉末冶金法制备的纯钽片的再结晶温度为1200℃，电子束熔炼的纯钽片的再结晶温度为800～900℃。2种钽片分别采用不同的退火工艺都可获得50—100μm的晶粒，其深冲件的表面质量良好。
The powder metallurgy and electron-beam melting methods were used to prepare tantalum blanks. Tantalum sheets with a thickness of 0.3 mm were produced through forging and rolling of the as-obtained blanks. The recrystallization temperatures of the two kinds of pure tantalum were measured and the effects of the different recrystallized annealing process on the grain size and deep-drawn performance was studied. The results show that the recrystallization temperature of the powder metallurgic tantalum sheets is 1 200℃, and the electron-beam melting tantalum sheets is ranged from 800℃ to 900℃. The grain size of 50 - 100 μm can be achieved by the two methods if different annealing process was used, and the surface quality of the deep-drawn parts are fine.
出处
《矿冶工程》
CAS
CSCD
北大核心
2007年第2期78-80,83,共4页
Mining and Metallurgical Engineering
基金
军工配套项目(细晶无织构钽板的研究)
关键词
纯钽片
再结晶温度
晶粒尺寸
深冲性能
pure tantalum
recrystallization temperature
grain size
deep-drawn performance
