期刊文献+

植酸自组装单分子膜对白铜B30缓蚀作用的研究 被引量:11

Study of self-assembled monolayer of plant acid for B30 corrosion and its inhibiting mechanism
下载PDF
导出
摘要 用一种环境友好型金属处理剂植酸在白铜B30表面制备了自组装单分子膜(SAMs),研究了该膜在3%NaCl中对白铜B30的缓蚀作用。通过交流阻抗法和极化曲线法的研究表明,在酸性和碱性环境中,植酸SAMs对白铜B30均有良好的缓蚀效果,其对白铜B30的缓蚀效果在酸性环境中要优于碱性环境;且组装时间6h效果最好,缓蚀率为84.87%,同时分析表明其缓蚀机理为化学吸附过程。 The self-assembled monolayer of plant acid on B30 surface in 3% NaCl solution has been investigated by AC impedance method and polarization curve. The results indicate that the SAMs had inhibition effect for B30 corrosion, in the condition of both acidity and alkalescence. But it's better inhibition effect in acidity. Furthermore, the inhibition efficiency was 84.87% if B30 was immersed in plant acid solution for 6h. It also shows that the inhibiting mechanism of plant acid is a chemical adsorption process.
出处 《功能材料》 EI CAS CSCD 北大核心 2007年第4期562-564,572,共4页 Journal of Functional Materials
基金 国家自然科学基金(20406009) 上海市曙光计划资助项目(04SG55) 厦门大学固体表面物理化学国家重点实验室资助项目(200512) 上海市重点学科建设资助项目(P1304)
关键词 植酸 自组装膜 白铜 交流阻抗 极化曲线 plant acid the SAMs B30 EIS polarization curve
  • 相关文献

参考文献18

  • 1Kong Desheng, Wan Lijun, Chen Shenhao, et al. [J]. Corrosion & Protection, 2003,24(12) :507-512.
  • 2Ma Hongfang, Xian Dong, Sun Hua, et al. [J]. Journal of Shandong University of Architecture and Engineering,2004,19(3) :86-89.
  • 3Liu Yali, Yu Zhanfeng, Zhou Shuxue, et al. [J]. Paint & Coatings Industry, 2004,34(9) : 27-31.
  • 4Cao Chunan. Principles of Erosive Electrochemistry (Second Edition) [M]. Beijing: Chemical Industry Press, 2004.
  • 5Wang Chuntao, Chen Shenhao, Zhao Shiyong, et al. [J].Acta Chimica Sinica, 2003,61 (2):151-155.
  • 6Liu Jinhong, Wang Yihong, Guo Zhirui, et al. [J]. Journal of Materials Protection, 2004,37 (1):6-9.
  • 7Kong Desheng, Chen Shenhao, Wan Lijun, et al. [J].Chemical Journal of Chinese Universities, 2003, 24 (10)1847-1851.
  • 8Libinis P E,Whitesides G M. [J]. J Am Chem Soc, 1992,114 : 9022 -9028.
  • 9Zamborimi F P, Crooks R M. [J]. Langmuir, 1998, 14.3279-3286.
  • 10Zhang Hongsheng. [J]. Electroplating & Finishing,1999,18(4):38-41.

同被引文献127

引证文献11

二级引证文献60

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部