摘要
通过对高功率InGaN(蓝)LED倒装芯片结构+YAG荧光粉构成白光LED的分析,可以得出这种结构能提高发光效率和散热效果的结论。通过对白光LED的构成和电流/温度/光通量的分析,可知在蓝宝石衬底和环氧树脂的界面间涂敷一层硅橡胶能改善光的折射率。改进光学器件的封装技术,可以大幅度提高大功率LED的出光率(光通量)。
By analyzing the flip chip structure of high power InGaN blue ＋YAG fluorescence powders white light emitting diode （ LED ）, it shows that it can improve the luminous and heat dissipation efficacy, And by analyzing the composing of white LED and relations between current, temperature and luminous flux, refractive index is improved the interface between the sapphire underlay and epoxy resin by gelatinizing a layer silica gel. By improving the optical encapsulation, the luminous flux of LED can be improved greatly.
出处
《电子与封装》
2007年第3期16-19,共4页
Electronics & Packaging
关键词
高功率白光LED
倒装结构
发光效率
high power white LED
flip chip structure
luminous efficacy
