液流悬浮加工的工艺参数研究

Research on Process Variables of Hydrodynamic Suspension Polishing

提出了一种液流悬浮研抛加工的新工艺方法,开发了基于三坐标数控铣床的液流悬浮研抛试验系统。通过分析研抛过程的影响因素,确定了以研抛液介质、磨料(SiC)浓度、研抛头转速和研抛时间作为试验考察对象,并对光学玻璃K9进行研抛加工正交试验。试验结果证明了利用液流悬浮纳米磨料的方法可以实现光学晶体材料的亚微米去除和超光滑表面加工,并给出了各影响因素的优选结果。

A new hydrodynamic suspension polishing technique is put forward and a hydrodynamic suspension experimental system based on the three - coordinate NC milling machine developed. With the help of analysis of the influencing factors in polishing process, the objects of investigation in experiments have been determined, including liquid medium, abrasive concentration （SiC）, revolution speed of polishing head and polishing time. The orthogonal experiments have been carried out on the optical glass k9 and the experimental results have indicated that the microscopic cutting and nanometer super - smooth surface processing can be realized with the polishing process of hydrodynamic suspending SiC nano - abrasive, The optimized process variables for various influencing factors are also provided.