摘要
4,4′-双(3-氨基苯氧基)二苯甲酮(443BAPDBP)和马来酸酐(MA)在N,N′-二甲基甲酰胺(DMF)溶剂、催化剂和共沸剂的作用下,一步法合成了新型醚酮双马来酰亚胺树脂,对其进行了进一步的表征,并对其应用作了初步探索研究。结果表明,合成得到的443BMIPOBP树脂熔点为88～90℃,纯度为98．2%,用443- BMIPOBP/DABPA/HTPPI预聚物比BDM/DABPA/HTPPI体系对铜材具有更高的黏接强度,其剪切强度为17．5 MPa。
The novel bismaleimide containing ether bond and ketone bond was synthesized by one step reaction between 4, 4＇-bis（3-aminophenoxy）benzophenone （443BAPOBP） and maleic anhydride（MA） in the presence of N, N＇-dimethylformamide（DMF）, catalyst and azeotropic agent. Then, the obtained product was further characterized. Subsequently, the application was also studied. Test showed that the melting point of 443- BMIPOBP resin was 88 - 90 ℃, its purity was 98.2%, its shear strength for adhesive copper was 17.5 MPa more than that of BDM - DABPA - HTPPI system.
出处
《热固性树脂》
CAS
CSCD
2007年第1期30-32,共3页
Thermosetting Resin
