基于表面响应法的半导体器件热阻网络技术研究

Thermal Resistance Network Technology for Electronic Device Based on Response Surface Optimization Method

热阻网络是在扩展传统内热阻定义的基础上,将计算机模拟的全模型采用优化方法简化而得到的。该方法继承了全模型可预测在各种工作环境下的芯片结温的优点。在分析半导体器件内热阻的基础上,提出了一种新的独立于边界条件的热阻网络模型,并运用表面响应法,建立VCM(Valid Chip Model)的热阻网络模型。通过验证,该模型具有很高的精确度,适用于复杂的系统级热设计。

Thermal resistance network based on expanded traditional thermal resistance was obtained from detailed numerical simulation, which was capable of predicting chip temperature in any thermal environment. This presentation offers a further expanded inner thermal resistance methodology and proposes a novel thermal resistance network independent of validated boundary conditions. The response surface optimization method was used to found a thermal resistance network of the Valid Chip Model （VCM）. It was found that the new thermal resistance network is of high accuracy and more robust and valid in thermal design of complicated systems.