摘要
为提高高体积分数AlNp/Cu复合材料的致密度,采用粉末冶金液相烧结工艺制备了含10vol%Al的AlNp/Cu复合材料,与未添加Al的AlNp/Cu复合材料以及AlN颗粒表面镀铜的AlNp/Cu复合材料进行了组织与热性能的比较。X射线衍射与显微组织观察表明,添加的Al在烧结过程中扩散至铜基体形成固溶体,并能有效的提高AlNp/Cu复合材料的致密度,添加10vol%Al的复合材料相对密度与未添加Al的AlNp/Cu复合材料相比提高了3.5%。热膨胀试验表明:50-550℃之间,40%AlNp/Cu复合材料、添加10vol%Al的40%AlNp/Cu复合材料及AlN颗粒表面镀铜的40%AlNp/Cu复合材料的平均热膨胀系数分别为15.7、13.4和13.4,热循环后的残余应变分别为0.51%、0.18%和0.24%。Al的添加及AlN颗粒表面镀铜都能有效地降低AlNp/Cu复合材料的热膨胀系数和热循环后的残余应变。与表面镀铜的AlNp/Cu复合材料相比,Al的添加在一定程度上降低了AlNp/Cu复合材料的热传导性能,但材料的制备成本显著降低。
For improving the relative density of high volume fraction AlNp/Cu composite, 10vol% pure Al were added to prepare AlNp/Cu composite by liquid sintering powder metallurgy technology. The microstructure and thermal expansion behavior of the composite were compared with AlNp /Cu composite without addition of Al and copper-coated AlNp /Cucomposite. The results of X ray diffraction and microstructure observing indicate that the additional pure Al diffuses into copper matrix during sinteing and forms solid solution, the relative density of the AlNp/Cu composite is improved 3.5 percent compared with that of AlNp/Cu composite without addition of Al. The results of thermal expansion experiment indicate that the average thermal expansion coefficients in the temperature range of 50℃ to 550 ℃ are 15.7,13.4 and 13.4, and the residual strain is 0.51% ,0.18% and 0.24% for the AlNp/Cu,AlNp /Cu with addition of Al and copper-coated AlNp/Cu composites,respectively. The addition of pure AI and copper coated AlNp all can improve the relative density and decrease the thermal expansion coefficient and residual strain of AlNp/Cu composites.The addition of pure Al decrease the thermal conductivity of AlNp/Cu composite at some extents, but the fabrication cost decreases obviously compared with the copper-coated AlNp/Cu composite.
出处
《材料热处理学报》
EI
CAS
CSCD
北大核心
2007年第2期7-11,共5页
Transactions of Materials and Heat Treatment
基金
天津理工大学科技发展基金(LG03020)
关键词
铝
ALN
铜基复合材料
显微组织
热膨胀
Al
AlN
copper matrix composite
microstructure
thermal expansion