期刊文献+

添加铝对AlN_p/Cu复合材料组织与热性能的影响 被引量:7

Influence of Al addition on microstructure and thermal properties of AlN_P/Cu composite
下载PDF
导出
摘要 为提高高体积分数AlNp/Cu复合材料的致密度,采用粉末冶金液相烧结工艺制备了含10vol%Al的AlNp/Cu复合材料,与未添加Al的AlNp/Cu复合材料以及AlN颗粒表面镀铜的AlNp/Cu复合材料进行了组织与热性能的比较。X射线衍射与显微组织观察表明,添加的Al在烧结过程中扩散至铜基体形成固溶体,并能有效的提高AlNp/Cu复合材料的致密度,添加10vol%Al的复合材料相对密度与未添加Al的AlNp/Cu复合材料相比提高了3.5%。热膨胀试验表明:50-550℃之间,40%AlNp/Cu复合材料、添加10vol%Al的40%AlNp/Cu复合材料及AlN颗粒表面镀铜的40%AlNp/Cu复合材料的平均热膨胀系数分别为15.7、13.4和13.4,热循环后的残余应变分别为0.51%、0.18%和0.24%。Al的添加及AlN颗粒表面镀铜都能有效地降低AlNp/Cu复合材料的热膨胀系数和热循环后的残余应变。与表面镀铜的AlNp/Cu复合材料相比,Al的添加在一定程度上降低了AlNp/Cu复合材料的热传导性能,但材料的制备成本显著降低。 For improving the relative density of high volume fraction AlNp/Cu composite, 10vol% pure Al were added to prepare AlNp/Cu composite by liquid sintering powder metallurgy technology. The microstructure and thermal expansion behavior of the composite were compared with AlNp /Cu composite without addition of Al and copper-coated AlNp /Cucomposite. The results of X ray diffraction and microstructure observing indicate that the additional pure Al diffuses into copper matrix during sinteing and forms solid solution, the relative density of the AlNp/Cu composite is improved 3.5 percent compared with that of AlNp/Cu composite without addition of Al. The results of thermal expansion experiment indicate that the average thermal expansion coefficients in the temperature range of 50℃ to 550 ℃ are 15.7,13.4 and 13.4, and the residual strain is 0.51% ,0.18% and 0.24% for the AlNp/Cu,AlNp /Cu with addition of Al and copper-coated AlNp/Cu composites,respectively. The addition of pure AI and copper coated AlNp all can improve the relative density and decrease the thermal expansion coefficient and residual strain of AlNp/Cu composites.The addition of pure Al decrease the thermal conductivity of AlNp/Cu composite at some extents, but the fabrication cost decreases obviously compared with the copper-coated AlNp/Cu composite.
出处 《材料热处理学报》 EI CAS CSCD 北大核心 2007年第2期7-11,共5页 Transactions of Materials and Heat Treatment
基金 天津理工大学科技发展基金(LG03020)
关键词 ALN 铜基复合材料 显微组织 热膨胀 Al AlN copper matrix composite microstructure thermal expansion
  • 相关文献

参考文献9

  • 1张蜀平,郑宏宇.电子封装技术的新进展[J].电子与封装,2004,4(1):3-9. 被引量:34
  • 2师瑞霞,尹衍升.氮化铝陶瓷的制备及其在复合材料中的应用研究[J].硅酸盐通报,2004,23(1):58-61. 被引量:9
  • 3刘德宝,崔春翔,马叙.氮化铝颗粒表面镀铜及其增强铜基复合材料[J].兵器材料科学与工程,2005,28(2):8-11. 被引量:6
  • 4虞觉奇 易文质 陈邦迪.二元合金状态图集[M].上海:上海科学技术出版社,1984.574.
  • 5SHU Kuen-ming,Tu G.The microsturcture and the thermal expansion characteristics of Cu/SiCp composites[J].Materials Science and Engineering A,2003,349:236-247.
  • 6Fei W D,Hu M,Yao C K.Thermal expansion and thermal mismatch stress relaxation behaviors of SiC whisker reinforced aluminum composite[ J ].Materials Chemistry and Physics,2002,77:882-888.
  • 7ZHANG Qiang,WU Gao-hui,JIANG Long-tao,et al.Thermal expansion and dimensional stability of Al-Si matrix composite reinforced with high content SiC[ J].Materials Chemistry and Physics,2003,82:780-785.
  • 8Li G,Lu L.Liquid phase sintering of metal matrix composites[ J].Journal of Materials Processing Technology,1997,63:286-291.
  • 9Byung G Kim,Dong S L,et al.Effects of thermal processing on thermal expansion coefficient of a 50vol% SiCp/Al composite[ J ].Materials Chemistry and Physics,2001,72:42-47.

二级参考文献26

  • 1周和平 刘耀诚 乔粱.高热导率氮化铝陶瓷的低温过渡液相烧结[J].中国学术期刊文摘,1999,5(1):106-108.
  • 2Dai Ximmng, Li Qingfeng, Ding Mingqin. Synthesis of ultrafine AIN powerds in an Al - O- C- N system. Tsinghua Scienee and Technology , 1999,4(2) : 1480 - 1484.
  • 3Pathak L C.Ray A K.Das S.et al.Carbothermal synthesis of nanocrystalline alumina nitride powders.J Am Ceram Soc,1999,82(1):257-260
  • 4Groza J R , Risbud S H, Yamazaki K. New processing of alumina nitride. J Mater Res, 1992,7( 10 ) : 2643 - 2645.
  • 5Do shuuai. A new type aluminum nitride based composite.The American Ceramic Society Bulletin. 1997,76(2):24-25.
  • 6Kim Y W.Densification of AIDN-AIN composite.British Ceramic Transactions,1998,97(3):97-99
  • 7Wieslaw Z.Preparation of erosion resistant aluminum nitride composite.High-Techno Mater Alert,1997.14(6):4
  • 8Slack G A,Tranzili R A,Pohl R O,et al.The intrinsic thernkal conductivity of AIN. J Phvs Chem Solids. 1987.48 ( 7 ) :641 - 648.
  • 9Tummala R R.Ceramic and glass-ceramic packaging in the 1990s.J Am Ceram Soc,1991,74(5):895-901
  • 10Windischmann H.Intrinsic stress in the AIN prepared by dual-ion beam sputtering.Thin Solid Films.1987.154(1-2):159-163

共引文献64

同被引文献82

引证文献7

二级引证文献28

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部