摘要
介绍了微波集成电路中一种新的制作技术———脉冲图形电镀技术，并对影响脉冲图形电镀技术的关键因素———亚硫酸盐镀金溶液的组成及稳定性、添加剂ＴＴ—１和ＰＰ—１的作用、脉冲波形的影响、产生镀层结瘤和微坑。
The pulse pattern electroplating (PPE) technology used for fabricating Microwave Integrated Circuits (MIC)patterns was introduced To the PPE technology,some influential key factors,such as sulphitic gold electrolyte composition and its stability,TT-1 and PP-1 additives,pulse wave types and nodules and pits formation in the deposited films were analyzed and discussed at length
出处
《电子工艺技术》
1997年第2期68-71,共4页
Electronics Process Technology
关键词
脉冲电镀
图形电镀
微波集成电路
制造工艺
Pulse electroplating Pattern electroplating Additives Gold plating
