摘要
研究了预焊剂咪唑(C3H4N2)在氮气中的热稳定性,并在PCB的焊接工艺中首次使用N2作为热处理的氮氛。结果表明:改革后的工艺操作简便,咪唑预焊剂抗氧化性能及可焊性能优良,符合PCB可焊性要求。
In this paper,a reseach is done to the thermal stability of imidazole(C 3H 4N 2) under nitrogen and byusing N 2 as an environmental atmosphere in the fabrication of printed circuit boards(PCB) an experiment is firstly performed,from uhich it has concluded that the technology is simpler to operate with imidazole layer more thermally stable,resistant to oxidation and superior in solerability.So the preflux imidazole is promizing in use as organic solerability preservative.
出处
《电子工艺技术》
1997年第2期85-86,共2页
Electronics Process Technology