甲磺酸盐电镀Pb-Sn合金工艺研究

Study on Pb-Sn Alloy Electroplating in Methylsulfonate Bath

研究了甲磺酸电镀Pb-Sn合金的电解液组成,讨论了主盐、游离酸、稳定剂的质量浓度以及阴极电流密度对Pb-Sn合金镀层中Sn含量的影响。采用Hull槽试验方法确定了甲磺酸电沉积Pb-Sn合金镀层的阴极电流密度范围。根据研究结果确定了甲磺酸体系电镀Pb-Sn合金润滑镀层的工艺规范。

Methylsulfonate bath composition for Pb-Sn alloy electroplating was studied. Concentrations of main salts, free acid and stabilizers and cathodic current density on the Sn content in the Pb-Sn alloy coating were discussed. Range of cathodic current density suitable for electroplating Pb-Sn alloy coating in the methylsulfonate bath was determined with Hull cell test. And the technological standard for Pb-Sn alloy lubrication coating electroplating in methlsulfonate bath was finally established in accordance with the results of this study.