期刊文献+

新型光刻技术的现状与进展 被引量:10

Current Status and Development of Emerging Photoetching Technology
下载PDF
导出
摘要 大尺寸、细线宽、高精度、高效率、低成本成为IC产品发展的趋势,随着集成度的提高,芯片制造中最关键的制造工艺——光刻技术也面临着愈来愈多的难题。新兴的193nm浸入式技术、157nm极短紫外光刻(EUV)、电子束投影光刻(EPL)、纳米压印光刻等技术将是解决这些问题的关键。介绍了193nm浸入式技术、157nm光刻技术、电子束投影(EPL)光刻技术以及纳米压印光刻技术。指出纳米压印光刻技术具有生产效率高、成本低、工艺过程简单等优点,能实现分辨率达5nm以下的水平,是最具发展前途的下一代光刻技术之一。 Greater size, thinner line width, higher accuracy, higher efficiency and lower cost become the tendency of IC product development. Along with integration rate enhancement, the photoetching technology of the most essential manufacture craft in chip manufacture is facing increasingly difficult problems. The 193 nm immersion lithography technology, the 157 nm EUV lithography, the EPL lithography and nanolithography are the key to solue these questions. It's pointed out that nanolithography has the obvious merits of high efficiency, low lost and simple process, and it can realize resolution being under the lovel of 5nm. Nanolirhograply is one of the most promising next generation photoetching technologies.
出处 《材料导报》 EI CAS CSCD 北大核心 2007年第5期102-104,共3页 Materials Reports
关键词 光刻 光源 曝光 photoetching, photosource, exposal
  • 相关文献

参考文献20

  • 1纳米浸入式光刻技术工业化在即[J].中国高新技术产业导报,2005,.
  • 2翁寿松.193nm浸入式光刻技术独树一帜[J].电子工业专用设备,2005,34(7):11-14. 被引量:8
  • 3Yang G G.Modern optical testing technologies.Hang zhou:Zhejiang University Press,1997.575
  • 4Onkels E D.SPIE 27th,Annual international symposium and education program on microlithography.2002,4691:203
  • 5http://www.nanonex.com/Technology.htm
  • 6Nguyen K B,Cardinale G F.Fabrication of metal-oxide-semiconductor devices with extreme ultraviolet lithography.Jvac Sci Techn,1996,B14(6):4188
  • 7金春水,王占山,曹健林.软X射线投影光刻技术[J].强激光与粒子束,2000,12(5):559-564. 被引量:8
  • 8Chou S Y,Krauss P R,Renstrom P J.Imprint of sub-25 nm vias and trenches in polymers.Appl Phys Lett,1995,67(21):3114
  • 9R.Pelzer,Paul Kettner.Full wafer replication of nanometer features.Micro Nanotechnology,2005,34(2):256
  • 10梁迎新,王太宏.纳米器件的一种新制造工艺——纳米压印术[J].微纳电子技术,2003,40(4):2-7. 被引量:7

二级参考文献47

  • 1翁寿松.193nm光刻技术延伸方法[J].电子工业专用设备,2004,33(11):14-16. 被引量:2
  • 2Colburn M,Johnson S,Stewart M et al.Step-and-flash imprint lithography:a new approach to high resolution patterning[C].Proceedings of the SPIE's 24th international symposium on microlithography:emerging lithographic technologies III,Santa Clara,CA,1999.37
  • 3Kumar A,Whitesides G M.Features of gold having micrometer to centimeter dimensions can be formed through a combination of stamping with an elastomeric stamp and an alkanethiol ""ink"" followed by chemical etching[J].Applied Physics Letters,1993,63(14):200
  • 4Sreenivasan S V,Willson C G,Schumaker N E et al.Low-Cost nanostructure patterning using step and flash imprint lithography[C].Nanostructure science,metrology,and technology,Proceedings of SPIE-the international society for optical engineering,2002.187-194
  • 5Watanabe K,Morita T,Kometani R.Nanoimprint using three-dimensional microlens mold made by focused-ion-beam chemical vapor deposition[J].Journal of vacuum science & technology B:Microelectronics and nanometer structures,2004,22(1):22-26.
  • 6Jakeway S C,Crabtree H J,Veres T et al.Transition of MEMS technology to nanofabrication[C].ICMENS'03 2003,Banff,Alberta,canada,2003.118-122.
  • 7Schift H,Jaszewski R W,David C et al.Nanostructuring of polymers and fabrication of interdigitated electrodes by hot embossing lithography[J].Microelectronic engineering,1999,46:121-124.
  • 8Scheer H C,Schulz H.A contribution to the flow behaviour of thin polymer films during hot embossing lithography[J].Microelectronic engineering,2001,56:311-332.
  • 9Vratzov B,Fuchs A,Lemme M et al.Large scale ultraviolet-based nanoimprint lithography[J].Journal of vacuum science & technology B:microelectronics and nanometer structures,2003,21(6):2760-2764.
  • 10http://www.amo.de/amica/nanoimprint.html

共引文献33

同被引文献89

引证文献10

二级引证文献20

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部