半导体器件封装热阻测试方法及其研究

The Testing Method and Study for Pakage Thermal Resistance of Semiconductor Device

本文介绍了用标准芯片法测量半导体器件的封装热阻的测试原理及测量装置,并对该测量系统的重复性及误差进行了讨论。通过对半导体PN结温度系数的研究发现:温度系数的测定准确性主要与被测点的温度范围有关,而与所选温度点的个数关系不大.最后本文对半导体器件开帽与不开帽测量热阻进行了讨论.

In this paper, we described the testing principal and equipment of packaged thermal resistance of semiconductor device by standard chip method. The repetity and error of the testing system are discussed too. Having done detailed study for temperature coefficient of semiconductor PN junction, we found the accuracy of temperature coeffieient has stronger relation to temperature range than the numbers of selected tssting tempetature points. The thermal resistance difference be-tween .the opening package and normal package is discussed too.