不同结构和外形的多层陶瓷封装制作技术

Manufacturing Technology of Different Structure and Outilne Multilayer Ceramics Package

本文从CAD设计、收缩率控制、定位方法、层压等方面简述了不同结构和外形的多层陶瓷封装的制作技术.

This paper describes the manufacturing technology of different structure and outline multilayer ceramics package from CAD designing, shrinkage controlign,locate mode and lamination etc.