期刊文献+

Ti/Al异种材料真空扩散焊及界面结构研究 被引量:21

A study of vacuum diffusion bonding and interface structure of Ti/Al dissimilar materials
下载PDF
导出
摘要 采用钛板表面渗铝工艺成功地实现了Ti/Al的扩散连接,通过扫描电镜(SEM)、显微硬度、X射线衍射等,对Ti/Al扩散焊接头区的组织结构进行了分析.试验结果表明:Ti/Al扩散焊接头区由钛侧界面、扩散过渡区、铝侧界面组成;在Ti/Al扩散焊界面附近的过渡区中可能形成Ti3Al、TiAl和TiAl,金属间化合物.控制工艺参数能够减小生成的金属间化合物层的厚度.距扩散焊界面较远铝基体一侧的显微硬度为30-40HM,钛基体和过渡区界面附近没有明显的脆性相. Ti/Al dissimilar materials were successfully bonded together by means of vacuum diffusion bonding after aluminizing on the surface of Ti sheet. The microstructure and phase constituent for the Ti/Al diffusion bonded joint were analyzed by means of scanning electron microscopy (SEM) , microsclerometer and X - ray diffractometry (XRD). The test results indicated that Ti/Al diffusion joint included Ti side interface, diffusion transition zone and Al side interface. Intermetallics Ti3Al, TiM and TiAl3 were formed in the transition zone near Ti/Al interface. Controlling technology parameters of diffusion bonding could reduce the thickness of intermetallics layer. The microhardness of the Al substrate away from the diffusion interface was 30 -40HM. There was no obvious brittle phase near the Ti/Al interface of Ti substrate and transition zone.
出处 《材料科学与工艺》 EI CAS CSCD 北大核心 2007年第2期206-210,共5页 Materials Science and Technology
基金 国家自然科学基金资助项目(50375088) 山东省中青年优秀科学家奖励基金资助项目(2006BS04004)
关键词 扩散焊接 显微组织 界面 金属间化合物 diffusion bonding microstructure interface intermetallic
  • 相关文献

参考文献10

二级参考文献41

共引文献33

同被引文献161

引证文献21

二级引证文献63

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部