钎焊散热器用钎料的成份改进及性能

Composition Improvement and Properties of Solders for Brazing of Radiators

本文根据金属学原理及钎焊润湿性原理，以铅－锡钎料为基，以降低钎料熔点和增加其润湿性为目的，以Ａｇ、Ｈｇ、Ｃｄ、Ｓｂ、Ｂｉ为改善钎料工艺性能的添加元素，通过正交试验，提出了一种含锡量为１４％的新材料。这种新材料的工艺性能可与含锡４０％的铅－锡钎料相媲美。

Based on the principles of metallography and wettability of brazing, a new solder containing 14% Sn is presented through an orthogonal experiment, which is a Pb Sn base solder with additional elements of Ag,Hg. Cd,Sb,Bi,with the purpose of dcreasing its fusion point and increasing its wettability and improving its technological properties.The technologieal properties of this new solder can bear comparison with Pb Sn solder comtaining 40% Sn.