微型笔直写制备厚膜阻性元件技术研究

Study on thick film resistors fabrication by micropen direct writing technology

为了实现电子元器件的快速制备,设计并实现了一种微型笔直写装置。利用该装置进行了电阻浆料的直写制备。研究了直写电阻元件的工艺特点、表面形貌和性能。得到了优化的工艺范围:笔头通径100～450μm,笔头到基板表面距离8～20μm,电阻高温烧结之后线宽100～500μm,膜厚5～15μm。所直写的电阻边缘整齐,表面较平整,烧结后,方阻约为0.92 kΩ/□。

To fabricate electronic components rapidly, a micropen direct writing system was designed and manufactured. With this equipment, thick film resistors were fabricated. The direct writing processes, the morphology and performance of the resistors were studied. Optimum parameters are gotten： diameter of pen can be 100-500 μm; distance between pen tip and substrate is about 8-20 μm. By these processes, the resistors with line width of 100-500 μm, thickness of 5-15 μm and square resistance of 0.92 k Ω/口 are obtained.