摘要
通过选择与优化有机树脂、固化剂、溶剂、填料等,开发了片式电阻用的系列有机聚合物电子浆料。该系列浆料包括端涂银导体浆料、包封介质浆料、标志浆料。采用厚膜印刷工艺,200℃固化。浆料中铅含量小于1×10–4。端涂银导体浆料固化膜耐酸性好,附着力高;包封介质浆料固化膜层平整致密,且绝缘电阻≥104MΩ,击穿电压≥500 V;标志浆料细线分辨率好。
The Organic Polymer Pastes （OPP） in chip resistance were researched with selecting and modifying organic resin, curing agent, solvent, and filler. OPP includes organic silver conductor paste, organic packaging insulation pastes and organic marking paste. The customer can use OPP by standard thick film printing process with curing temperature 200℃. The lead content in OPP is less than 10^-4. The conductor paste curing film has perfect acid resistance and adhesion. The packaging dielectric pastes curing film is flat and compaction and has insulation resistance more than10^4 MΩ, breakdown voltage more than DC500 V. The marking paste has good line resolution.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2007年第5期49-52,共4页
Electronic Components And Materials
关键词
复合材料
有机聚合物电子浆料(OPP)
有机银导体浆料
有机介质浆料
储存期
环氧树脂
composite material
organic polymer electronic paste （OPP）
organic silver conductor paste
organic insulation pastes
storage and shelf life
epoxy resin
