摘要
应用数理统计结合工艺设计、制造工艺控制参数等因素及Surface Evolver软件仿真技术的方法,建立球栅阵列(BGA)器件焊接合格率的预测模型,运用该模型可以找出影响焊接合格率的制约因素。结合仿真技术模拟焊点形态,可以找出造成焊点缺陷时各参数之间的关系并提出相应的解决方案,从而优化工艺设计及制造工艺控制参数。
By mathematical statistics based on the manufacturing process variations and variations of component and PCB, using the software of surface Evolver simulation, mode of BGA solder yield predictor was built. Using the mode and simulating the solder joint shapes, find the root cause of solder defects identify the relationship of designand process parameters, suggest design improvemet.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2007年第5期62-65,共4页
Electronic Components And Materials
关键词
半导体技术
球栅阵列
焊接合格率
数理统计模型
焊接缺陷
焊点形态
semiconductor
ball grid array （BGA）
solder yield
mathematical statistical model
solder defect
solder joint shape
