摘要
方形扁平无引线(QFN)封装是方形扁平封装(QFP)和球栅阵列(BGA)封装相结合发展起来的先进封装形式,是SMT技术中产品体积进一步小型化的换代产品。讨论了QFN技术的改进及工艺自动化发展进程,指出其必将成为半导体器件高端主流封装形式之一。
The advanced QFN package （quad flat non-leaded package） is combined with the QFP （quad flat package） and the BGA （ball grid array） package. It is traded era product with the SMT technique become more and more decreasing size. Technical improvement of QFN and automatic development in the technique were discussed. It is pointed out that QFN will become one of the most mainstream in semiconductor device packages.
出处
《半导体技术》
CAS
CSCD
北大核心
2007年第3期185-187,共3页
Semiconductor Technology
关键词
封装
无引线封装
半导体器件
package
non-leaded package
semiconductor device
